RF/Dielectric Heating Simulations using ANSYS HFSS and Icepak

Share:
Check out the recorded webinar

In this session, we demonstrate how to model RF/dielectric heating losses using HFSS software by Ansys, and how to couple these losses into Ansys Icepak to determine temperature of your RF and microwave components.

Session Presenters

Graham Stevens

Application Engineer, Simulation

Graham Stevens is a certified ANSYS Application Engineer (AE) and has been designing new products for over 25 years.  His focus is on bringing products from the laboratory into production and cost reduction, and serves as a simulation AE for low frequency and high frequency electronics, electronics cooling and reliability, optics, optimization, and multi-physics.  He has a B.S. in Physics, and a Masters in Manufacturing Engineering

  			  
  		

More Upcoming Events

            
            
Thursday
24
September
10:00am PDT
Online

Understanding the Autodesk Inventor API Object Model

Get a stronger foundation for advanced Inventor automation by understanding occurrences, component definitions, documents, proxies, and how they relate.
Webinar Details
            
            
Thursday
1
October
10:00am PDT
Online

From Idea to Market Faster with the Autodesk Fusion Manage NPI Accelerator

Webinar Details
            
            
Thursday
8
October
10:00am PDT
Online

Using Inheritance in Autodesk Inventor Automation

Build more organized Inventor automation with inheritance, using parent and child classes to share functionality, reduce repetitive code, and simplify your add-ins.
Webinar Details
            
            
Thursday
15
October
10:00am PDT
Online

Building the Digital Thread with PLM

Webinar Details