Thermal Simulation: A Fundamental Deep Dive

Heat transfer is one of the most common physical phenomena in engineering problems. Thermal studies provide vital information that can help make engineering design decisions, thereby improving product quality and reducing manufacturing, material and warranty costs. In this session, we begin with the very fundamentals of heat transfer as a physical phenomenon and take a deep dive into thermal FEA with Inventor Nastran. Watch Application Engineer Nikhil Venkat as he covers: 

  • Fundamentals of heat transfer
  • Thermal FEA – workflow and best practices
  • Automating your thermal stress analysis
Related Product:
Autodesk Inventor Nastran
Total Time: 2:52:46
Presenter:
KETIV Support Team

KETIV Support Team

Support and Product Experts
The KETIV Support Team is a talented group of product experts and application engineers. They spend most of their time providing dedicated to support to our customers, but they can also be found leading trainings and creating helpful learning content.