Thermal Simulation: A Fundamental Deep Dive
Heat transfer is one of the most common physical phenomena in engineering problems. Thermal studies provide vital information that can help make engineering design decisions, thereby improving product quality and reducing manufacturing, material and warranty costs. In this session, we begin with the very fundamentals of heat transfer as a physical phenomenon and take a deep dive into thermal FEA with Inventor Nastran. Watch Application Engineer Nikhil Venkat as he covers:
- Fundamentals of heat transfer
- Thermal FEA – workflow and best practices
- Automating your thermal stress analysis
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Autodesk Inventor Nastran