Ansys HFSS: Best-In-Class 3D High Frequency Structure Simulation Software
Ansys HFSS is versatile full-wave 3D electromagnetic (EM) simulation software tailored for the design and simulation of high-frequency electronic products, including antennas, components, interconnects, connectors, ICs, and PCBs.
3D EM Simulation Software
3D Electromagnetic Field Simulator for RF and Wireless Design
Ansys HFSS is a premier 3D electromagnetic (EM) simulation software, tailored for the design and simulation of high-frequency electronic products. From antennas and antenna arrays to RF or microwave components, high-speed interconnects, filters, connectors, IC packages, and printed circuit boards, HFSS empowers engineers worldwide to craft cutting-edge designs.
- Component-to-System EM Workflow
- Encrypted 3D Design Share
- Coupled EM System Solver
- Automatic Adaptive Meshing
From Chips to Ships, Solve Them All with HFSS
HFSS Mesh Fusion maintains the utilization of the identical “electromagnetically aware” adaptive meshing technology as previously employed, ensuring accuracy by solving a fully coupled electromagnetic matrix for each adaptive mesh step and at every frequency sweep point.
HFSS Mesh Fusion’s patented technology enables much more complex designs to be simulated with the same rigor, accuracy, and reliability of Ansys HFSS. It accomplishes this by applying targeted meshing technologies within the same design, appropriate to the local geometry.
Ansys HFSS Highlights
HFSS’s unmatched capacity, coupled with indisputable accuracy, enables engineers to address RF, microwave, IC, PCB, and EMI problems for most complex systems.
*only available with Electronics Enterprise
What’s New
January 2025 | New HFSS capabilities enhance performance, meshing, and modeling, resolving component intersections and supporting large-scale antenna arrays, unlocking new application spaces for SI/PI engineers, RF designers, and antenna specialists.
Ansys HFSS Enhanced Mesh Fusion
Enhanced Mesh Fusion with improved component priority and intersection handling enables precise 3D modeling by resolving complex intersections. This ensures superior mesh quality and accurate simulations for high-tech industries, supporting SI/PI engineers and RF designers.
3D Component Array Enhancements
3D component array enhancements enable efficient simulation of multiple arrays, SBR+ regions, and lattice contacts. This capability simplifies the modeling of large-scale antenna arrays for satellite communication and aerospace, empowering antenna designers and RF engineers.
Applications
EM Simulation Software Antenna Design and Placement
Electromagnetic simulation of antenna design and its interaction with the entire system enables you to evaluate antenna placement, EMI/co-site interference and more.
Autonomous System Validation
Ansys model-based simulation solutions enable autonomous vehicle testing and validation for software-in-loop, hardware-in-loop and driver-in-loop analysis.
Autonomous Sensor Development
Ansys provides a comprehensive autonomous vehicle sensor simulation capability that includes lidar, radar and camera design and development.
Electromagnetic Interference and Compatibility (EMI/EMC)
Minimizing electromagnetic interference with simulation delivers high-performance, compliant and safe electronics systems, down to the microchip level.
PCBs, ICs & IC packages
Ansys’ complete PCB design solution enables you to simulates PCBs, ICs, and packages and accurately evaluate an entire system.
Capabilities
Physics Defines the Mesh; Mesh Does Not Define the Physics
The Ansys HFSS simulation suite offers a wide array of solvers to tackle various electromagnetic challenges, spanning from passive IC components to extensive EM analyses like automotive radar scenes for ADAS systems. With its dependable automatic adaptive mesh refinement, you can devote your attention to design instead of spending time on mesh optimization.
This automation and assured accuracy set HFSS apart from other EM simulators, where manual user intervention and multiple solutions are often necessary to validate the mesh’s suitability and accuracy.
Key Features
HFSS is the premier EM tool for R&D and virtual design prototyping, effectively reducing design cycle time while enhancing product reliability and performance.
- EMI/EMC analysis
- Radio Frequency Interference (RFI) in complex environments
- Installed antenna and RF cosite analysis
- RF systems and circuits analysis
- Signal and Power Integrity analysis
EMI/EMC Analysis
Ansys Electronics Desktop seamlessly integrates Ansys electromagnetic 3D and 2.5D field solvers with the robust circuit- and system-level solutions in Ansys RF Option. This combination empowers engineers to diagnose, isolate, and eliminate EMI and radio-frequency issues (RFI) early in the design cycle.
Radio Frequency Interference (RFI) in Complex Environments
EMIT collaborates with Ansys HFSS to merge RF system interference analysis with top-notch electromagnetic simulation, allowing for precise modeling of installed antenna-to-antenna coupling. This comprehensive solution accurately predicts the effects of RFI in multi-antenna environments with multiple transmitters and receivers.
Installed Antenna and RF Cosite Analysis
In Ansys HFSS, engineers can simulate infinite and finite phased-array antennas, accounting for all electromagnetic effects. This includes mutual coupling, array lattice definition, finite array edge effects, dummy elements, and element blanking, achieved through advanced unit cell simulation.
RF Systems and Circuits Analysis+
When combined with HFSS, circuits and RF systems simulation technologies create an end-to-end high-performance workflow for RF, EMI/EMC and other applications.
Signal and Power Integrity Analysis+
By combining with HFSS, SI Circuits enable the analysis of signal integrity, power integrity, and EMI issues arising from shrinking timing and noise margins in PCBs, electronic packages, connectors, and other complex electronic interconnects.
Encrypted 3D Components
Encrypted 3D Component support in HFSS 3D Layout allows companies to share their detailed component designs (connector, antenna, SMD chip capacitor) without divulging IP such as geometry and material properties.
Multipaction
Ansys HFSS now includes multipaction analysis, addressing an electronic phenomenon that can lead to breakdown due to high electric fields in a vacuum. This enhancement enhances solutions for aerospace applications and 5G satellites.
