RF/Dielectric Heating Simulations using ANSYS HFSS and Icepak

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In this session, we demonstrate how to model RF/dielectric heating losses using HFSS software by Ansys, and how to couple these losses into Ansys Icepak to determine temperature of your RF and microwave components.

Session Presenters

Graham Stevens

Application Engineer, Simulation

Graham Stevens is a certified ANSYS Application Engineer (AE) and has been designing new products for over 25 years.  His focus is on bringing products from the laboratory into production and cost reduction, and serves as a simulation AE for low frequency and high frequency electronics, electronics cooling and reliability, optics, optimization, and multi-physics.  He has a B.S. in Physics, and a Masters in Manufacturing Engineering

  			  
  		

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