Electrothermal Mechanical Stress Reference Design Flow for Printed Circuit Boards and Electronic Packages
This paper presents a reference design flow for solving the electrical, thermal and mechanical challenges of a printed circuit board (PCB) using simulation tools from ANSYS.
Accelerating Innovation with Seamless Engineering Data and Processes
This eBook explores the core motivators to investigate more connected engineering data and processes. Learn about overcoming the challenges and putting the solutions in place to truly connect product development.
Equip your engineers with the knowledge and tools needed to maximize your organization's product design and engineering data. Enroll in our complimentary course offering a comprehensive guide from planning to launching a new product data management solution.