Ansys HFSS is a premier 3D electromagnetic (EM) simulation software, tailored for the design and simulation of high-frequency electronic products. From antennas and antenna arrays to RF or microwave components, high-speed interconnects, filters, connectors, IC packages, and printed circuit boards, HFSS empowers engineers worldwide to craft cutting-edge designs.
HFSS Mesh Fusion maintains the utilization of the identical “electromagnetically aware” adaptive meshing technology as previously employed, ensuring accuracy by solving a fully coupled electromagnetic matrix for each adaptive mesh step and at every frequency sweep point.
HFSS Mesh Fusion’s patented technology enables much more complex designs to be simulated with the same rigor, accuracy, and reliability of Ansys HFSS. It accomplishes this by applying targeted meshing technologies within the same design, appropriate to the local geometry.
HFSS’s unmatched capacity, coupled with indisputable accuracy, enables engineers to address RF, microwave, IC, PCB, and EMI problems for most complex systems.
*only available with Electronics Enterprise
January 2024 Release
The 2024 R1 release brings new simulation capabilities to HFSS for 3D Layout, HPC, FlexPCB, and antenna array design.
IC mode in HFSS 3D Layout now includes support for encrypted technology files. HFSS can import encrypted technology files -and use them in simulation within a 3D layout.
Flex PCB support is included in HFSS 3D through layout components. You can import a Flex PCB layout into HFSS 3D to assemble a complete system and run simulations in a streamlined workflow.
Ansys has made additional improvements to memory resource efficiency with new upgrades to the Distributed Matrix Assembly solver.
Two new HFSS features extend Ansys’ dominance in 5G/6G antenna design. Mask automation automatically uses CSV files to create an array. Metadata export allows you to export specific data from the array.
Electromagnetic simulation of antenna design and its interaction with the entire system enables you to evaluate antenna placement, EMI/co-site interference and more.
Ansys model-based simulation solutions enable autonomous vehicle testing and validation for software-in-loop, hardware-in-loop and driver-in-loop analysis.
Ansys provides a comprehensive autonomous vehicle sensor simulation capability that includes lidar, radar and camera design and development.
Minimizing electromagnetic interference with simulation delivers high-performance, compliant and safe electronics systems, down to the microchip level.
Ansys’ complete PCB design solution enables you to simulates PCBs, ICs, and packages and accurately evaluate an entire system.
HFSS is the premier EM tool for R&D and virtual design prototyping, effectively reducing design cycle time while enhancing product reliability and performance.
Ansys Electronics Desktop seamlessly integrates Ansys electromagnetic 3D and 2.5D field solvers with the robust circuit- and system-level solutions in Ansys RF Option. This combination empowers engineers to diagnose, isolate, and eliminate EMI and radio-frequency issues (RFI) early in the design cycle.
EMIT collaborates with Ansys HFSS to merge RF system interference analysis with top-notch electromagnetic simulation, allowing for precise modeling of installed antenna-to-antenna coupling. This comprehensive solution accurately predicts the effects of RFI in multi-antenna environments with multiple transmitters and receivers.
In Ansys HFSS, engineers can simulate infinite and finite phased-array antennas, accounting for all electromagnetic effects. This includes mutual coupling, array lattice definition, finite array edge effects, dummy elements, and element blanking, achieved through advanced unit cell simulation.
When combined with HFSS, circuits and RF systems simulation technologies create an end-to-end high-performance workflow for RF, EMI/EMC and other applications.
By combining with HFSS, SI Circuits enable the analysis of signal integrity, power integrity, and EMI issues arising from shrinking timing and noise margins in PCBs, electronic packages, connectors, and other complex electronic interconnects.
Encrypted 3D Component support in HFSS 3D Layout allows companies to share their detailed component designs (connector, antenna, SMD chip capacitor) without divulging IP such as geometry and material properties.
Ansys HFSS now includes multipaction analysis, addressing an electronic phenomenon that can lead to breakdown due to high electric fields in a vacuum. This enhancement enhances solutions for aerospace applications and 5G satellites.
