Electronics Cooling & PCB Thermal Simulation and Analysis
Ansys Icepak offers robust electronic cooling solutions powered by the renowned Ansys Fluent computational fluid dynamics (CFD) solver. It enables comprehensive thermal and fluid flow analyses of integrated circuits (ICs), packages, printed circuit boards (PCBs), and electronic assemblies. Leveraging the Ansys Electronics Desktop (AEDT) graphical user interface (GUI), the Ansys Icepak CFD solver ensures seamless navigation and intuitive operation.
- Unstructured, Body-fitted Meshing: Achieve optimized meshing for accurate simulations and analyses.
- Comprehensive Thermal Reliability Solution: Address thermal reliability challenges effectively with Ansys Icepak’s comprehensive suite of tools.
- High-fidelity CFD Solver: Benefit from high-fidelity simulations powered by the industry-leading CFD solver.
- Industry-Leading Multiscale Multiphysics: Uncover intricate multiscale multiphysics phenomena with Ansys Icepak’s advanced capabilities.
Ansys Icepak Highlights
Perform conduction, convection and radiation conjugate heat transfer analyses, with many advanced capabilities to model laminar and turbulent flows, and species analysis including radiation and convection.
What’s New
July 2025 | The 2025 R2 release delivers transformative advancements aimed at streamlining user workflows, expediting product development, and elevating meshing precision and capability. Ansys Icepak, integrated within Ansys Electronics Desktop (AEDT), now delivers dramatically faster design performance and significantly enhanced mesh accuracy for complex geometries.
TZR Import
TZR imports are now significantly faster and more efficient, delivering up to 1,000 times the speed improvements over the previous release. This leap in performance is driven by the shift from scripted to compiled import, streamlining model transitions and significantly enhancing the overall user experience.
GPU Solver Support
Unlock faster simulation speeds, empowering more design iterations in less time. The advanced GPU solver accelerates a broader range of electronics cooling applications. Expanded capabilities now include robust support for turbulence models, internal fans, Joule heating, transient analysis, non-uniform boundary conditions, sequential solutions, and more, enabling more profound insights and faster innovation.
Thermal Mesh Fusion
Achieve superior mesh quality with enhanced refinement control through incremental levels. Users can now apply positive or negative increments to adjust mesh density, refining or coarsening individual objects as needed. This advancement empowers analysts to create high-quality initial meshes and enables designers to leverage robust automated meshing, driving greater accuracy, flexibility, and efficiency in simulation workflows.
Applications
Thermal simulation PCBs, ICs and IC packages
Ansys’ complete PCB design solution enables you to simulates PCBs, ICs, and packages and accurately evaluate an entire system.
Electronics Reliability
Learn how Ansys integrated electronics reliability tools can help you solve your biggest thermal, electrical and mechanical reliability challenges.
Batteries
Ansys battery modeling and simulation solutions use multiphysics to help you maximize battery performance and safety while reducing cost and testing time.
Electric Motors
Ansys electric motor design software progresses from concept design to detailed electromagnetics, thermal and mechanical analysis of electric motors.
Capabilities
Optimizing Electronics Thermal Management with Ansys Icepak
Unveiling Ansys Icepak’s Power
Discover how Ansys Icepak transforms thermal management in electronics. From predicting airflow and temperature to enhancing heat transfer, Icepak delivers unparalleled solutions for assemblies and printed circuit boards (PCBs).
Revolutionary CAD-Centric Approach
Ansys Icepak revolutionizes thermal management with its CAD-centric and multiphysics user interfaces. By integrating mechanical and electrical CAD functionalities, Icepak tackles the most challenging thermal problems in electronics, ensuring precise solutions are validated against real-world products.
Sophisticated Algorithms for Precision
Take advantage of Icepak’s sophisticated CAD healing, simplification, and metal fraction algorithms. These advanced techniques not only reduce simulation times but also provide highly accurate solutions, thanks to automated meshing and solver schemes that ensure a true representation of electronics applications.
Empowering Electronics Innovation
Experience the future of electronics design with Ansys Icepak. Maximize performance, reliability, and efficiency with cutting-edge thermal management solutions tailored to your specific needs. Unlock the potential of your designs with Icepak’s advanced capabilities.
Key Features
Ansys Icepak includes all modes of heat transfer — conduction, convection and radiation — for steadystate and transient electronics cooling applications.
- Electronics Desktop 3D layout GUI
- DC joule heating analysis
- Multiple-fluid analysis
- Reduced order flow and thermal
- Thermo-electric cooler modeling
- Package characterization
- Integrated graphical modeling environment
Electrothermal Analysis of a PCB
Heat can degrade the performance and reliability of electronic devices. Power dissipation of ICs and power losses across the board are key inputs for thermal analysis.
Electronics Cooling
Ansys leads the industry in computational fluid dynamics (CFD) solutions for electronics cooling. Their integrated workflow, coupled with chip-level thermal integrity simulation software, enables precise thermal analysis for chip-package, PCB, and system designs.
Thermal Reliability
Tight integration with SIwave, Ansys Mechanical, and Sherlock enables Ansys Icepak to accurately predict temperature rises and ensures thermal reliability. Seamlessly conduct multi-physics analyses for electromigration, dielectric breakdown, and solder joint fatigue within the Ansys ecosystem.
