Introduction to Ansys Icepak – How to Simulate PCB Enclosures

In this KETIV Virtual Academy session, we demonstrate in Ansys Icepak how to model PCB cooling for a typical enclosure. Join Application Engineer, Graham Stevens, as he demonstrates 3D Components of PCBs, Heatsinks, and Fans for both liquid and air cooled applications.

By the end of this session, you’ll have a better understanding of how to model PCB cooling within Ansys Icepak and be able to apply this knowledge to your own PCB designs.