Check out the recorded webinar
In this KETIV Virtual Academy session, we demonstrate in Ansys Icepak how to model PCB cooling for a typical enclosure. Join Application Engineer, Graham Stevens, as he demonstrates 3D Components of PCBs, Heatsinks, and Fans for both liquid and air cooled applications.
By the end of this session, you’ll have a better understanding of how to model PCB cooling within Ansys Icepak and be able to apply this knowledge to your own PCB designs.
Session Presenters
Graham Stevens
Application Engineer, Simulation
Graham Stevens is a certified ANSYS Application Engineer (AE) and has been designing new products for over 25 years. His focus is on bringing products from the laboratory into production and cost reduction, and serves as a simulation AE for low frequency and high frequency electronics, electronics cooling and reliability, optics, optimization, and multi-physics. He has a B.S. in Physics, and a Masters in Manufacturing Engineering
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