Introduction to Ansys Icepak – How to Simulate PCB Enclosures

Share:
Check out the recorded webinar

In this KETIV Virtual Academy session, we demonstrate in Ansys Icepak how to model PCB cooling for a typical enclosure. Join Application Engineer, Graham Stevens, as he demonstrates 3D Components of PCBs, Heatsinks, and Fans for both liquid and air cooled applications.

By the end of this session, you’ll have a better understanding of how to model PCB cooling within Ansys Icepak and be able to apply this knowledge to your own PCB designs.


  			  
  		

More Upcoming Events

            
            
Thursday
14
December
10:00am PST
Online

Parametric Study Using Ansys Fluent

Webinar Details
            
            
Thursday
21
December
10:00am PST
Online

Configuring Excellence: Data Management Implementation

Webinar Details
            
            
Thursday
4
January
10:00am PST
Online

Product Optimization Inside of Tacton

Webinar Details
            
            
Thursday
11
January
10:00am PST
Online

Parametric Study using Ansys optiSLang

Webinar Details
            
            
Thursday
18
January
10:00am PST
Online

Strategies for Seamless Data Population: Data Management Implementation

Webinar Details