Ansys Icepak offers robust electronic cooling solutions powered by the renowned Ansys Fluent computational fluid dynamics (CFD) solver. It enables comprehensive thermal and fluid flow analyses of integrated circuits (ICs), packages, printed circuit boards (PCBs), and electronic assemblies. Leveraging the Ansys Electronics Desktop (AEDT) graphical user interface (GUI), the Ansys Icepak CFD solver ensures seamless navigation and intuitive operation.
Perform conduction, convection and radiation conjugate heat transfer analyses, with many advanced capabilities to model laminar and turbulent flows, and species analysis including radiation and convection.
January 2024 Release
Thermal Mesh fusion enables automated partitioning of the target geometry into subdomains of similarity and then applies the most appropriate mesher to the subdomain. These are then re-combined.
By enabling Fluent’s GPU solver, Icepak can now employ multiple GPUs to accelerate simulation in HPC/Distributed Computing environments by up to 70x.
Ansys’ complete PCB design solution enables you to simulates PCBs, ICs, and packages and accurately evaluate an entire system.
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Ansys Icepak includes all modes of heat transfer — conduction, convection and radiation — for steadystate and transient electronics cooling applications.
Heat can degrade the performance and reliability of electronic devices. Power dissipation of ICs and power losses across the board are key inputs for thermal analysis.
Ansys leads the industry in computational fluid dynamics (CFD) solutions for electronics cooling. Their integrated workflow, coupled with chip-level thermal integrity simulation software, enables precise thermal analysis for chip-package, PCB, and system designs.
Tight integration with SIwave, Ansys Mechanical, and Sherlock enables Ansys Icepak to accurately predict temperature rises and ensures thermal reliability. Seamlessly conduct multi-physics analyses for electromigration, dielectric breakdown, and solder joint fatigue within the Ansys ecosystem.
